Capability


          A, Capability for Rigid Printed Circuit Boards:

No.
Item
Value
1
Min Line Width
3 mil
2
Min Line Space
3 mil
3
Max Layer Count
24
4
Min Hole Diameter (mil)
8
5

Min. HWTC  (mil)

7
6

Max. AspectRatio

12:1
7

SMT Pitch/BGA Pitch (mil)

18/12
8
Plating Thickness

(1).Plating Ni Thickness2.5~5um.

(2).Plating Au Thickness0.05~2um (per client)

9
Impedance Control
+/-7%
10
Blind & Buried
Yes
11
HDI
3+N+3, N+N
12
Base Copper
1/3,…, 6 OZ, 4 OZ with UL
13
Copper Thickness (Outer)
5 OZ
14
Max Board Thickness (mil)
120
15
Min Core Thickness (mil)
2
16
Type of Surface Finish

HASL, lead-free HASL(PAD2-5um, ENIG(0.03-0.15um), Flash Gold(0.05-0.1um), Thick Gold(0.1-1.0um), Selective Gold Plating, OSP(0.1-0.5um), Flux, Selective OSP/HASL, Immersion Tin(0.8-1.2um), Immersion Silver(0.1-0.5um).Or per client.


B, Capability for Flexible Printed Circuit Boards: 
No.
Item
Value
1
Special Material
Low Flow PP, PET
2
Build-up Material
PI Bond Ply
3
Copper Foil
1/3,...,2OZ
4
 Min. L/S
3mil
5
Impedance Control
+/-10%
6
Max Aspect Ratio (Thr. Hole)
8:1
7
Min. SM Opening (mil)
2
8
Type of Surface Finish
OSP, Selective OSP, Flash Gold, Thick Gold
 
         
C,   Capability for Metal Core Printed Circuit Boards:
No.
Item
Value
1
Special Material
Aluminum, Copper, etc.
2
Max Heat Conduction
4W/M.K
3
Max Layer Count
4
4
Min Line width/space
3mil
5
Max Withstand Voltage
4KV
6
Dimensions Tolerance
(1) According to the request.

(2) Tolerance +/-0.05mm ( without any instruction)

7
Min Hole D.
0.4mm
8
Type of Surface Finish
Immersion Au/Ni

               For more details, please send email: info@hifipcb.com